| Summary: | 碩士 === 國立交通大學 === 工學院精密與自動化工程學程 === 100 === This study concentrates on the soldering reactions and the mechanical response between Sn-1.0Ag-0.5 and Sn-3.0Ag-0.5Cu lead-free solders and ENEPIG surface finish.
In order to investigate mechanical property of this two different alloy, the samples are firstly stored in high temperature condition then tested with two difference shear rate, i.e., ball shear test(0.0001 m/s) and high speed ball shear test(1 m/s). The results indicated that both shear strength in difference shear rate of Sn-1.0Ag-0.5Cu joints lower than Sn-3.0Ag-0.5Cu, however, the fracture resistance ability is better at high speed ball shear test.
Keywords: ENEPIG, Ball shear test, High speed ball shear test.
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