| Summary: | 碩士 === 國立交通大學 === 工學院永續環境科技學程 === 100 === In recent years, the global climate change caused by the greenhouse gas emission has gained worldwide attention. The CVD and Dry Etch process in semiconductor industry use a significant amount of PFCs (Perfluorinated Carbons) gases. They are high global warming potenitial gases and thus their effects can not be neglected.
This research focuses on the comparison of PFCs emission estimation methods and reduction potential of semiconductor factory based on the 2006 IPCC Guidelines Tier 2a and Tier 2b calculation methods. The results reveal that the PFCs emission of greenhouse gas is 35,999 ton CO2e/year according to Tier 2a method, which is 3% (1,155 ton CO2e/year) higher than that based on Tier 2b emission estimation. Thus adopting Tier 2b method to calculate the PFCs emission is more beneficial for the semiconductor industry. On comparing the local scrubber devices for PFCs emission control, by adopting fuel combustion based scrubbers the PFCs emissions can be less than that by adopting electric heating scrubber, which is 29.8% in reduction (132,005 ton CO2e/year). For the emission estimation of substituting PFCs from C3F8 to C4F8, it reveals that the utilization rate of PFCs can be increased and thus the overall PFCs emission can be reduced by 29.8% in terms of CO2 equivalent emission (10,389 ton CO2e/year). And the PFCs gas use can be reduced by 39.4% (15,154 kg PFCs). This corresponds to a cost benefit of $2.47 million NTD/year.
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