Investigation on the Electromigration Behavior of High Pb Solder and Its Flip Chip Solder Joint

博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 100

Bibliographic Details
Main Authors: Ying-TaChiu, 邱盈達
Other Authors: Kwang-Lung Lin
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/80735941306597540664