Design of Intelligent Cutting Methods for Solar Cell Wafers

• Main Authors: Yu-Jia Shiue, 薛育嘉
• Other Authors: Cheng-Jian Lin
• Format: Others
• Language: en_US
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/89789802285608480735

碩士 === 國立勤益科技大學 === 資訊工程系 === 100 === As defective blocks are easily appeared around the wafer edges during the solar cell wafer production process, the usability of whole wafers is generally limited. The traditional approaches to prevent this problem are basically to cut a certain fixed width away, among the rim area. Nevertheless, the removal of such defective-like regions often leads to the loss of non-flaw areas. In order to tackle this drawback, this study proposed an intelligent cutting system for solar cell wafers. The resulted system consists of three major components for (1) capturing image from the specific wafer by camera and locating the wafer region, (2) detecting the faulty regions on the wafer, and (3) planning an optimal cutting path by potential functions. In addition, since the traditional potential function cannot be applied efficiently and effectively to wafer cutting, this study proposed two novel potential-function-relative algorithms. The first algorithm added a reverse force in the repulsive force function, which makes the planned path reaching the ideal cutting position. The second algorithm combined with fuzzy theory, which is able to enhance the result of path planning and reduce the complexity of algorithm. Experimental results demonstrated that our proposed intelligent cutting system is able to plan the optimal cutting path for each solar cell wafer and preserves a relatively maximal flawless area by cutting the minimal wafer edges.