Interfacial Reactions Between High-Bi Alloys and Various Metallic Substrates
碩士 === 國立中興大學 === 化學工程學系所 === 100 === In this study, the Bi-xSn(x=2,5,10wt.%Sn) alloys joined with the Cu and Ni substrates are used to investigate the interfacial reactions and shear strength of the high-Bi/Cu and high-Bi/Ni solder joint systems. For the high-Bi/Cu joints, there is only Cu3Sn forme...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pf25p6 |