Add Thiourea for Acidic Copper System

• Main Author: 張曉筑
• Other Authors: 梁 世 明
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/18954122324851127846

碩士 === 明新科技大學 === 化學工程與材料科技研究所 === 100 === There were different kinds of additives used in the process of electroplating copper. The experiment focused on the effect of the electroplating procedure of copper by changing the thiourea concentration, observing the structure of the surface, rate of metal deposition, analysis of crystal structure and the change of resistivity with the equipments of SEM, EDS, XRD and four-point prove. The reason to use additives was to improve the roughness, smoothness and sameness of the coating. The acid sulfuric acid copper was the main electroplating solution due to it’s simple composition, stability, high current rate and high efficiency. 　　The results showed that when the additive of sulfur urea was at 10 ppm, the structure of the specimen was denser, the coating smoother, the deposition faster, resistivity higher and so on.