The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle

碩士 === 高苑科技大學 === 電子工程研究所 === 100 === Abstract Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is i...

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Bibliographic Details
Main Authors: Cheng,Chih Ching, 鄭志清
Other Authors: Yang,Yao Sheng
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/30899343709705653941

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