The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle

The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle

碩士 === 高苑科技大學 === 電子工程研究所 === 100 === Abstract Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is i...

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Main Authors: Cheng,Chih Ching, 鄭志清
Other Authors: Yang,Yao Sheng
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/30899343709705653941
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spelling ndltd-TW-100KYIT04280052015-10-13T21:02:41Z http://ndltd.ncl.edu.tw/handle/30899343709705653941 The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle 應用模流分析與場協同理論探討小尺寸IC封裝之充填平衡 Cheng,Chih Ching 鄭志清 碩士 高苑科技大學 電子工程研究所 100 Abstract Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is implemented for the investigation of the flow balance in different geometries with various gate designs by using a CAE simulation software, Moldex3D R10. Furthermore, an optimized geometric design can be gained through the assistance of simulation and its results. In this research we use PLASKON_SMT-B-1LV with glass fiber as material to analyze two feet four feet and five feet ingection by field synergy principle. The size of present model is 122mmX45mmX3mm, two cavities for one mould, the width of the IC plate is 0.4mm Keywords：Small size IC packaging、 Field synergy principle、 Flow balance Moldex3D、Glass fiber、Field Synergy Principle Yang,Yao Sheng Chang,Shiuh Ming 楊耀昇 張旭銘 2012 學位論文 ; thesis 100 zh-TW
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language zh-TW
format Others
sources NDLTD
description 碩士 === 高苑科技大學 === 電子工程研究所 === 100 === Abstract Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is implemented for the investigation of the flow balance in different geometries with various gate designs by using a CAE simulation software, Moldex3D R10. Furthermore, an optimized geometric design can be gained through the assistance of simulation and its results. In this research we use PLASKON_SMT-B-1LV with glass fiber as material to analyze two feet four feet and five feet ingection by field synergy principle. The size of present model is 122mmX45mmX3mm, two cavities for one mould, the width of the IC plate is 0.4mm Keywords：Small size IC packaging、 Field synergy principle、 Flow balance Moldex3D、Glass fiber、Field Synergy Principle
author2 Yang,Yao Sheng
author_facet Yang,Yao Sheng
Cheng,Chih Ching
鄭志清
author Cheng,Chih Ching
鄭志清
spellingShingle Cheng,Chih Ching
鄭志清
The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
author_sort Cheng,Chih Ching
title The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
title_short The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
title_full The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
title_fullStr The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
title_full_unstemmed The Investigation of Flow Balance In Small Size IC Packaging By Simulation Analysis And Field Synergy Principle
title_sort investigation of flow balance in small size ic packaging by simulation analysis and field synergy principle
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/30899343709705653941
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