| Summary: | 碩士 === 高苑科技大學 === 電子工程研究所 === 100 === Abstract
Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is implemented for the investigation of the flow balance in different geometries with various gate designs by using a CAE simulation software, Moldex3D R10. Furthermore, an optimized geometric design can be gained through the assistance of simulation and its results.
In this research we use PLASKON_SMT-B-1LV with glass fiber as material to analyze two feet four feet and five feet ingection by field synergy principle. The size of present model is 122mmX45mmX3mm, two cavities for one mould, the width of the IC plate is 0.4mm
Keywords：Small size IC packaging、 Field synergy principle、 Flow balance Moldex3D、Glass fiber、Field Synergy Principle
|
|---|
