A Study on Parameter Optimization for Cleaning PCBA by Dry Ice

• Main Authors: I-Jan Wang, 王怡然
• Other Authors: Shinn-Horng Chen
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/vp94cj

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 100 === This study used carbon dioxide as the cleaning agent to clear the ACF (Anisotropic Conductive Film) adhesive residue on the PCBA (Printed Circuit Board Assembly). Taguchi methods were applied by using factors including the use of solvent prior to adhesive removal, the nozzle height, the nozzle blowing pressure, the nozzle moving speed and the cylinder driving pressure on the dry ice for experimental configurations. The experiment assessed the effects of using carbon dioxide to remove the ACF adhesive residue on PCBA and search for the optimal combination of control parameters. The experimental output response LTB (Larger the Better) analysis was conducted by using adhesive removal rate as the indicator to determine the impact of various factors on the ACF adhesive residue on PCBA to obtain a group of optimal parameter combinations. According to the experimental results, the major factor affecting the adhesive removal effects is the use of solvent prior to adhesive removal with its contribution at 33.323 %. Confirmation experiments were conducted according to the optimal factor level combinations using Taguchi methods, and found that the adhesive removal effect is better if the nozzle moving speed is lower. However, too low moving speed of the nozzle would damage the insulation layer of the PCBA.