Investigation on drilling blind via of expoxy compound wafer by 532nm Nd：YVO4 laser
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 100 === Due to luxuriant development of portable electronic products in these years, a series of related products are designed to be high-density, high- performance, lightness and thinness. Various kinds of 3D structure packages, therefore, are weeding out the ol...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/64332266353591771551 |