The influence of Chemical Dipping De-flash Chemicals Components on Mold Compound discoloration
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 100 === This main part of this thesis is concerning with the discoloration phenomenon of epoxy molding compound (EMC) which cause by chemical dipping de-flash process (CD) in IC package assembly flow. The chemical dipping de-flash process is developed to solve th...
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| Format: | Others |
| Language: | zh-TW |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mb9f92 |
| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 100 === This main part of this thesis is concerning with the discoloration phenomenon of epoxy molding compound (EMC) which cause by chemical dipping de-flash process (CD) in IC package assembly flow. The chemical dipping de-flash process is developed to solve the delamination phenomenon of single side mold product occurred after Electro de-flash process (ED). CD process is using chemicals to soften mold flash and micro-etched lead frame surface. And then chemical will infiltrate the gap of mold flash and micro-etched lead frame to strip the flash on lead frame. But, some of ingredients in the chemical will cause compound discoloration. The purpose of this thesis is that adjust the chemicals composition (organic and inorganic base) ratio to and prevent from the discoloration phenomenon is occurred and keep the de-flash ability. The results were proved that as long as KOH concentration less than 3％ discoloration phenomenon will never occur. But in this case, need to raise the temperature and to extend the dipping time to meet the de-flash ability. That is, low KOH CD chemical used for de-flashing would be an important reference for improving the shortcoming of compound discoloration in industry
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