The influence of Chemical Dipping De-flash Chemicals Components on Mold Compound discoloration
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 100 === This main part of this thesis is concerning with the discoloration phenomenon of epoxy molding compound (EMC) which cause by chemical dipping de-flash process (CD) in IC package assembly flow. The chemical dipping de-flash process is developed to solve th...
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| Format: | Others |
| Language: | zh-TW |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mb9f92 |