| Summary: | 碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 100 === Abstract
Silver nanoplates with edge length of 74nm, 117 nm, and 162 nm were successfully used as novel catalysts toward electroless copper deposition (ECD). The result by linear sweep voltammetry shows that the current by these three nanoplates in the anodic reaction (formaldehyde oxidation) of ECD with 2,2′-bipyridine can be enhanced. The mean activity were 0.107, 0.250, and 1.017 mg•cm-2 for 74 nm, 117 nm, and 162nm Ag triangular nanoplates, respectively. The largest NPLs showed the highest activity. In the intended application, conductive Cu patterns on a flexible polyimide film using Ag nanoplat ink of 2.5 wt% solid content were successfully fabricated by inkjet printing combined with catalysed ECD. The thickness and resistivity were 222.9 nm and 0.053 Ωcm after an ECD time of 1000 seconds, respectively.
Conductive patterns on a flexible polyimide film using reduced graphene ink of 0.1 wt% solid content were successfully fabricated by inkjet printing. A four-point by printing graphene were 3.91 μm and 16.68 Ωcm at a printing of 200-times, respectively.
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