Reliability Analysis Of TCT/MSL Test For CIS Die Attach Process
碩士 === 義守大學 === 機械與自動化工程學系碩士在職專班 === 100 === The application of the CMOS image sensor has been popular which plays an important role in the video transmission and camera; CIS device is still made with the use of the electronic package technology, where many factors that affect the life of the prod...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01045787486856652231 |