Reliability Analysis Of TCT/MSL Test For CIS Die Attach Process

• Main Authors: Hsieh, Fengyuan, 謝峰源
• Other Authors: Hsu, Hsiangchen
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/01045787486856652231

碩士 === 義守大學 === 機械與自動化工程學系碩士在職專班 === 100 === The application of the CMOS image sensor has been popular which plays an important role in the video transmission and camera; CIS device is still made with the use of the electronic package technology, where many factors that affect the life of the product process and reliability, such as temperature, moisture, stress, pressure. This research study focused on the influence of the three different adhesive glue used in die attach process with temperature cycling test as well as material moisture absorption test of their physical properties, then change with the value of die shear test to verify. Experimental design will combine three kinds of material, such as aluminum substrate, silicon chip, and adhesive glue to assembly. TCT and MSL test have been applied to investigate the effects of CIS through the die shear test values to reflect the structure of the material adhesion in the environment. Based on experimental results, TCT temperature cycling (0℃~100℃, 10 cycle)of Loctite 3549 Epoxy Glue, the specimens obtained through the die shear test data compared that after original bake curing from 54.88kgf decreased to 53.1kgf, die shear force down with 1.78kgf (3.35%), the test conditions for the stress generated by the three materials; follow JEDEC MSL three different Level (30℃,60% RH; 85℃,60% RH; 85℃,85% RH) humidity grade test, for the Epoxy Glue test result of respectively from the original bake curing of 54.88kgf , through the die shear test data compared that decreased to 52.94kgf (3.64%),41.93kgf (24.38%), 33.7kgf (39.88%)。For the Silver Glue die shear test results show the force has been reduced form 47.15kgf to 42.99kgf (8.81%),34.36kgf (27.138%), 28.22kgf (40.15%) for respectively。For the Silicone Glue die shear test result show the force has been reduced form 14.73kgf to 12.79kgf (13.19%),9.33kgf (36.67%), 6.18kgf (58.06%) for respectively。Another optical microscopy experimental result presented the residual area for three different gules after MSL test. It is report the Epoxy Glue glue is the best options for die attach process.