The optimum design and analysis of thermal module for memory

• Main Authors: Yu-Chieh Siao, 蕭宇捷
• Other Authors: Min-shan Liu
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/87035739638506746703

碩士 === 逢甲大學 === 機械工程學所 === 100 === The memory plays an indispensable role in improving the calculating speed and working efficiency of technological products. To improve working efficiency, the manufacturing technology of memory is updating constantly and the calculating speed of electronic system becomes more fast, resulting in higher heat generation. To avoid excessive heat accumulate in the case of electronic system resulting in damage to electronic products, we add metallic heat sink outside the memory to conduct heat from it to the heat sink and increase forced convection to reduce temperature by cooling fan. It shall make sure that memory is in the best state when we use. In this study, the heat flow analysis software, FLUENT, was applied to research the effect of heat dissipation for memory with Taguchi method by changing four types of parameters, such as the material of heat sink, location of cooling fan, cooling fan speed and the number of holes on heat sink. The results of this research show that the most influential parameters are the material of heat sink and location of cooling fan. The optimum combination parameters are the cooper cooling fin, locations of fan are top side and left side, speed of cooling fan at 5m/s and 14 holes on the heat sink. It has the lowest temperature of memory and the cooling efficiency is improved about 16%.