The effect of three-dimensional swing plate on improving heat transfer of electronic devices

碩士 === 逢甲大學 === 機械工程學所 === 100 === This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above...

Full description

Bibliographic Details
Main Authors: Tzu-hsiang Hung, 洪子翔
Other Authors: Wen-Jeng Chang
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/83060134105353988533
id ndltd-TW-100FCU05489006
record_format oai_dc
spelling ndltd-TW-100FCU054890062015-10-13T21:27:32Z http://ndltd.ncl.edu.tw/handle/83060134105353988533 The effect of three-dimensional swing plate on improving heat transfer of electronic devices 擺動薄板對於增強三維電子元件冷卻之研究 Tzu-hsiang Hung 洪子翔 碩士 逢甲大學 機械工程學所 100 This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above the thermal wall. Our work considers a situation in which different positions possess various amplitudes along the longitudinal direction of the plate. The discussed factors include the distance between the plate and the thermal wall, the swing amplitude, the angular frequency, and the length of plate. The simulation results reveal that the increasing rate of heat transfer of the thermal wall is increased with the increment of swing amplitude and angular frequency. For the length of plate, the best cooling effect occurs while the plate covers half of the thermal-wall area. When it comes to the distance between the plate and the thermal wall, we find that the best heat transfer is reached as the plate is positioned in the middle of channel height. If the plate is above the middle position, the heat transfer becomes worse, but it still outperforms those without any plate. On the contrary, placing the plate lower than the middle position results in the poorer performance compared to the cases where no plate is utilized. In addition, the increasing rate of heat transfer in three-dimensional swing is less than that in the two-dimensional vibration. In general, when the plate covers half of the thermal wall, the heat transfer of the thermal wall with the plate in the vibration mode(the same amplitude at all position) is superior to that with the plate in the swing mode(different amplitudes at various positions along the longitudinal direction of the plate). It is also found that the strengthening influence of swing amplitude on the heat transfer of the thermal wall is greater than that of angular frequency, position of plate and length of plate. Wen-Jeng Chang 張文政 2012 學位論文 ; thesis 167 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 逢甲大學 === 機械工程學所 === 100 === This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above the thermal wall. Our work considers a situation in which different positions possess various amplitudes along the longitudinal direction of the plate. The discussed factors include the distance between the plate and the thermal wall, the swing amplitude, the angular frequency, and the length of plate. The simulation results reveal that the increasing rate of heat transfer of the thermal wall is increased with the increment of swing amplitude and angular frequency. For the length of plate, the best cooling effect occurs while the plate covers half of the thermal-wall area. When it comes to the distance between the plate and the thermal wall, we find that the best heat transfer is reached as the plate is positioned in the middle of channel height. If the plate is above the middle position, the heat transfer becomes worse, but it still outperforms those without any plate. On the contrary, placing the plate lower than the middle position results in the poorer performance compared to the cases where no plate is utilized. In addition, the increasing rate of heat transfer in three-dimensional swing is less than that in the two-dimensional vibration. In general, when the plate covers half of the thermal wall, the heat transfer of the thermal wall with the plate in the vibration mode(the same amplitude at all position) is superior to that with the plate in the swing mode(different amplitudes at various positions along the longitudinal direction of the plate). It is also found that the strengthening influence of swing amplitude on the heat transfer of the thermal wall is greater than that of angular frequency, position of plate and length of plate.
author2 Wen-Jeng Chang
author_facet Wen-Jeng Chang
Tzu-hsiang Hung
洪子翔
author Tzu-hsiang Hung
洪子翔
spellingShingle Tzu-hsiang Hung
洪子翔
The effect of three-dimensional swing plate on improving heat transfer of electronic devices
author_sort Tzu-hsiang Hung
title The effect of three-dimensional swing plate on improving heat transfer of electronic devices
title_short The effect of three-dimensional swing plate on improving heat transfer of electronic devices
title_full The effect of three-dimensional swing plate on improving heat transfer of electronic devices
title_fullStr The effect of three-dimensional swing plate on improving heat transfer of electronic devices
title_full_unstemmed The effect of three-dimensional swing plate on improving heat transfer of electronic devices
title_sort effect of three-dimensional swing plate on improving heat transfer of electronic devices
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/83060134105353988533
work_keys_str_mv AT tzuhsianghung theeffectofthreedimensionalswingplateonimprovingheattransferofelectronicdevices
AT hóngzixiáng theeffectofthreedimensionalswingplateonimprovingheattransferofelectronicdevices
AT tzuhsianghung bǎidòngbáobǎnduìyúzēngqiángsānwéidiànziyuánjiànlěngquèzhīyánjiū
AT hóngzixiáng bǎidòngbáobǎnduìyúzēngqiángsānwéidiànziyuánjiànlěngquèzhīyánjiū
AT tzuhsianghung effectofthreedimensionalswingplateonimprovingheattransferofelectronicdevices
AT hóngzixiáng effectofthreedimensionalswingplateonimprovingheattransferofelectronicdevices
_version_ 1718063309556547584