The effect of three-dimensional swing plate on improving heat transfer of electronic devices
碩士 === 逢甲大學 === 機械工程學所 === 100 === This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above...
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ndltd-TW-100FCU054890062015-10-13T21:27:32Z http://ndltd.ncl.edu.tw/handle/83060134105353988533 The effect of three-dimensional swing plate on improving heat transfer of electronic devices 擺動薄板對於增強三維電子元件冷卻之研究 Tzu-hsiang Hung 洪子翔 碩士 逢甲大學 機械工程學所 100 This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above the thermal wall. Our work considers a situation in which different positions possess various amplitudes along the longitudinal direction of the plate. The discussed factors include the distance between the plate and the thermal wall, the swing amplitude, the angular frequency, and the length of plate. The simulation results reveal that the increasing rate of heat transfer of the thermal wall is increased with the increment of swing amplitude and angular frequency. For the length of plate, the best cooling effect occurs while the plate covers half of the thermal-wall area. When it comes to the distance between the plate and the thermal wall, we find that the best heat transfer is reached as the plate is positioned in the middle of channel height. If the plate is above the middle position, the heat transfer becomes worse, but it still outperforms those without any plate. On the contrary, placing the plate lower than the middle position results in the poorer performance compared to the cases where no plate is utilized. In addition, the increasing rate of heat transfer in three-dimensional swing is less than that in the two-dimensional vibration. In general, when the plate covers half of the thermal wall, the heat transfer of the thermal wall with the plate in the vibration mode(the same amplitude at all position) is superior to that with the plate in the swing mode(different amplitudes at various positions along the longitudinal direction of the plate). It is also found that the strengthening influence of swing amplitude on the heat transfer of the thermal wall is greater than that of angular frequency, position of plate and length of plate. Wen-Jeng Chang 張文政 2012 學位論文 ; thesis 167 zh-TW |
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碩士 === 逢甲大學 === 機械工程學所 === 100 === This work numerically investigates the strengthening effects of swing plate on natural convection heat transfer in the vertical channel. The calculation is performed by the widely adopted software, FLUENT, combined with dynamic mesh. The plate is placed right above the thermal wall. Our work considers a situation in which different positions possess various amplitudes along the longitudinal direction of the plate. The discussed factors include the distance between the plate and the thermal wall, the swing amplitude, the angular frequency, and the length of plate. The simulation results reveal that the increasing rate of heat transfer of the thermal wall is increased with the increment of swing amplitude and angular frequency. For the length of plate, the best cooling effect occurs while the plate covers half of the thermal-wall area. When it comes to the distance between the plate and the thermal wall, we find that the best heat transfer is reached as the plate is positioned in the middle of channel height. If the plate is above the middle position, the heat transfer becomes worse, but it still outperforms those without any plate. On the contrary, placing the plate lower than the middle position results in the poorer performance compared to the cases where no plate is utilized. In addition, the increasing rate of heat transfer in three-dimensional swing is less than that in the two-dimensional vibration. In general, when the plate covers half of the thermal wall, the heat transfer of the thermal wall with the plate in the vibration mode(the same amplitude at all position) is superior to that with the plate in the swing mode(different amplitudes at various positions along the longitudinal direction of the plate). It is also found that the strengthening influence of swing amplitude on the heat transfer of the thermal wall is greater than that of angular frequency, position of plate and length of plate.
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Wen-Jeng Chang |
author_facet |
Wen-Jeng Chang Tzu-hsiang Hung 洪子翔 |
author |
Tzu-hsiang Hung 洪子翔 |
spellingShingle |
Tzu-hsiang Hung 洪子翔 The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
author_sort |
Tzu-hsiang Hung |
title |
The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
title_short |
The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
title_full |
The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
title_fullStr |
The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
title_full_unstemmed |
The effect of three-dimensional swing plate on improving heat transfer of electronic devices |
title_sort |
effect of three-dimensional swing plate on improving heat transfer of electronic devices |
publishDate |
2012 |
url |
http://ndltd.ncl.edu.tw/handle/83060134105353988533 |
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