| Summary: | 碩士 === 逢甲大學 === 產業研發碩士班 === 100 === In this study, miniature transient surge suppressor (TVS) chip, the premise was that did not affect the breakdown voltage, leakage current in power handling capability and has a certain reliability standards, the development of new technologies.
From larger wafer size scaling to the smaller size of this issue to expand the content was divided into four areas, namely wafer diffusion technology, insulating oxide technology, package structure improvement, environmental protection material application.
Wafer diffusion technology to reduce the impedance of the substrat diffusion time, the diffusion of the use of concentration as experimental adjustment factor, compare different process portfolio effect. We can find low resistance substrat wafer, using more diffusion time, reduced chip size and will be able to reach as far as possible to maintain the resistance power to impact the purpose. Finally, we get a miniature, characteristics before and miniature chips.
In oxide insulating technology, we can control the gas flow rate, gas type, perform temperature and execution time. The use of chlorine gas for the growth of the insulating layer in wet oxidation is to make use of chlorine to reduce the leakage current able to improve the quality of the oxide layer and improve the effect of the Si - SiO2 interface property. Compared to the leakage current international standards, we can produce products of low leakage current below the specifications of more than ten times, to enhance strengthen competitiveness.
The package structure to improve because, in the past, the copper stent surface mount package is not designed for TVS demand. We consider TVS bear and conduction power with special emphasis on the influence of the welding area; consider the characteristics of the packaging process, the stability of the internal structure of the ontology design plan. Compare the different package, although some did not meet better than shaft package to withstand power, but comparing the original use of the stent, we get better results.
In response to the environmental issues in Europe and the United States continue to be seriously, the government, the public is increasingly demanding products must improve environmentally friendly, we changed to use no heavy metals epoxy, no heavy metals, halogen-free epoxy resin as the package body. After visual inspection, the reliability test, the performance of our products in the electrical reliability performance can be compatible with international norms.
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