| Summary: | 碩士 === 逢甲大學 === 自動控制工程所 === 100 === The energy was getting short in recent years, causing the product price to rise. To research and develop the vicarious energy is getting more and more important, of which the first choice is the solar energy. Presently, the main way to produce silicon wafer, which is the major substrate of solar cells, is multi-wire sawing technology. The main purpose of this thesis is to analyze free vibration for the wire when cutting is in progress. At first, we derived the hyperbolic vibrating partial differential equation of wire for wiresaw, and solved the hyperbolic vibrating partial differential equation by method of characteristics. Simulation was conducted with parameters provided by A-TECH SYSTEM Co., Ltd. and the results were used to analyze the influences of wire speed, wire tension, initial conditions and boundary conditions on wire vibration.
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