Application of Stochastic Super-Efficiency Data Envelopment Analysis to Quality Problems in Wafer Fabrication Processes

碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 100 ===   Recently, Data Envelopment Analysis (DEA) has been widely used. However, the conventional DEA there exist a weakness that doesn''t allow stochastic variations in input and output, such as measure errors, enter errors and process variation...

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Bibliographic Details
Main Authors: Cheng-Hao Ko, 柯政豪
Other Authors: Chiun-Ming Liu
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/23151611945814715577