Application of 8D procedures to improve OEE efficiency – A case study for Semiconductor Photolithography

• Main Authors: Chi-Ming Chiu, 邱吉民
• Other Authors: Ming-Shiun Lu
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/75882970473202261989

碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 100 === DRAM firm always suffers from the unbalance of supply and demand. It Causes the production price is often lower than the cost. Sometimes this year we can earn a lot of money, but we may lose money in the next three years. So, DRAM firms always search the production ways to keep its increased efficiency and cost down. One solution of reducing cost is to decrease defects from production, to improve the tool efficiency, to increase the yield of the production and to promote the use time of the machines. Therefore how to increase the Overall Equipment Effectiveness (OEE) of a DRAM firm and keep defects out becomes a very important case for the DRAM production. According to TPM, the production of equipment can be improved and the defects can be removed, and then the production loss will be decreased deservedly. In additional, the soul of seeking the Zero loses, Zero Defect, Zero Break Down, and Zero Disaster may be taken as the target in all firms. A real improve process of Implementation is also proposed in the firm. This research is to watch out the change of the OEE in our factory, when OEE rate decreased, and influence the product shipment, how can me do, Using the 8D improve method to solve this problem in the PHOTO area at DRAM firm, we can find the problem, analysis the problem and catch the problem out, not only decreased the defect but also can increased the efficiency, we also can catch the data and archive all data into book, be the sample in firm, let other people used when someday need.