Comparison of SI and common-mode noise between differential serpentine and flat spiral delay lines

碩士 === 中原大學 === 電子工程研究所 === 100 === This paper investigates the comparisons of Signal Integrity(SI) and ElectromMagnetic Interference (EMI) performances between differential serpentine and flat spiral delay lines in microstrip and stripline structures. The TDT/TDR(Time-Domain Transmission/ Time-Doma...

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Bibliographic Details
Main Authors: Shin-Jie Lin, 林士傑
Other Authors: Guang-Hwa Shiue
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/40793135280549695425
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Summary:碩士 === 中原大學 === 電子工程研究所 === 100 === This paper investigates the comparisons of Signal Integrity(SI) and ElectromMagnetic Interference (EMI) performances between differential serpentine and flat spiral delay lines in microstrip and stripline structures. The TDT/TDR(Time-Domain Transmission/ Time-Domain Reflection) waveforms and eye diagrams are presented to evaluate SI. The time-domain common-mode noise and frequency-domain differential-to-common mode conversion are shown to help determining the performance of EMI is good or not. The time domain and frequency domain are simulated by HSPICE and HFSS, respectively. In stripline structure, the common-mode noise is low in both differential delay lines. In microstrip structure, the peak-to-peak common-mode noise is about 42% higher in differential flat spiral delay lines than in differential serpentine delay lines. The magnitude of differential-to-common mode conversion for differential flat spiral delay line is large than differential serpentine delay line at a wide frequency range, 0.1GHz~10GHz. In both microstrip and stripline, the SI performance of a differential flat spiral delay line is superior to that of a differential serpentine delay line. Guidelines for selecting differential delay lines are also proposed. Finally, the proposed analyses are validated by frequency- and time-domain measurements of common-mode noise and differential-to-common mode conversion in HSPICE and HFSS simulations.