Study of Wafer Bonding and Epitaxial Lift-Off to GaAs Single Junction Solar Cell
碩士 === 中原大學 === 電子工程研究所 === 100 === Abstract In this thesis, a metal structure of Pd/Ag/Au is employed to form an ohmic contact to the n-Si substrate with the annealing temperature and the metal thickness of Pd being varied to optimize the metal structure. The feasibility of the metal structure is e...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71120283266432860441 |