The Research For The Heat Sink Of Fan Cooling, Temperature Protection And Temperature Control Of Thermoelectric Cooler

• Main Authors: Lee, Tung-Chuan, 李東川
• Other Authors: Hsieh, Tsung-Huang
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/30451313936238288202

碩士 === 中華科技大學 === 機電光工程研究所在職專班 === 100 === The research of thermoelectric cooling has been reported in many literatures. Most of those studies were emphasized on thermoelectric materials performance, the improvement of thermal module performance and the cooling properties of heat sink. The cooling efficiency of cooling air flow path by applying fin type of fan-cooled heat sink, thermal protection and thermal control are less been discussed. This paper will present the case for the combination of thermoelectric cooler (TEC), heat sink and cooling fan package with single TEC and dual parallel TEC structured heating and refrigeration devices which were design and implementation for this study. To compare the surface temperature variation on fin of heat sink under energization was used for analyzing the cooling efficiency in different cooling fan design. We observed that it is required to guide cooling air passing through the bottom of heat sink in leaner path. In addition, the highest temperature spot of heat sink is the best position to install thermal protector. Simplified analog thermal controller was developed for saving energy by implementing unloading function on the dual loaded circuit design. Experiment result shows the temperature control variance being reduced below ±0.6℃ with unloading function activated by the actual environmental loading condition which is much less than the design Specification of ±1.0℃. It could improve the issue of too wide temperature control variation for existing commercialized single-stage temperature controller.