IC Assembly Product Inspection Using Image Processing Technigues
碩士 === 元智大學 === 資訊管理學系 === 99 === This study presents an image identification and measurement system for examining and testing the packaged semiconductor specifications. Most semiconductor processes rely on measurement instruments or inspectors to examine the finished product specifications visually...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80784666635552188858 |