Electromigration Reliability of Sn-Ag-Cu Solder Joints Containing Various Ag Contents

Electromigration Reliability of Sn-Ag-Cu Solder Joints Containing Various Ag Contents

碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === Electromigration phenomena in Cu/Sn/Cu、Cu/Sn-Ag-Cu/Cu solder joint were investigated in this study. In this study, we observed the Sn-Ag-Cu solder can reduce electromigration damages. The joints had a typical line-to-bump geometry with the Cu/Sn-Ag-Cu/Cu conf...

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Bibliographic Details
Main Authors:	Bo-Zong Chen, 陳柏宗
Other Authors:	Cheng-En Ho
Format:	Others
Language:	zh-TW
Published:	2011
Online Access:	http://ndltd.ncl.edu.tw/handle/75639826476992865070

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