Electromigration Reliability of Sn-Ag-Cu Solder Joints Containing Various Ag Contents

• Main Authors: Bo-Zong Chen, 陳柏宗
• Other Authors: Cheng-En Ho
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/75639826476992865070

碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === Electromigration phenomena in Cu/Sn/Cu、Cu/Sn-Ag-Cu/Cu solder joint were investigated in this study. In this study, we observed the Sn-Ag-Cu solder can reduce electromigration damages. The joints had a typical line-to-bump geometry with the Cu/Sn-Ag-Cu/Cu configuration, and the Ag contents of the Sn-Ag-Cu were 0, 1, 2, 3, 4 wt.%, respectively. Electromigration tests were carried out at an ambient temperature (25 degree Celsius) with a fixed 9000 A/cm2 at the contact of the Cu/Sn-Ag-Cu. Research showed doping an adequate Ag to the Sn-Cu alloy significantly increased resistance to electromigration. This diminished the electromigration-induced Sn-Cu alloy deformations and Cu metallization consumption, extending the lifetime of solder joints. In this study, we observed more Ag content in the Sn-Ag-Cu solder show better reduce electromigration damages. This is because the c-axis of b–Sn perpendicular to the electron flow in high Ag–content solder joints. The b–Sn orientation can be controlled by adopting Ag to solder joints. More details about the Ag effect on the electromigration reliability of solder joints will be presented in this thesis.