Observation of Electromigration-Induced beta-Sn Microstructure Evolution in Real Solder Joints with Various Joint Sizes
碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === White Tin (beta-Sn) has a body-center tetragonal (BCT) (a = b = 5.83 Å; c = 3.18 Å) structure. Due to the anisotropy, the axis has different properties. In this study, we observation of electromigration-induced beta-Sn microstructure evolution in Cu/Sn/Cu dif...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/78717313765009507150 |