| Summary: | 碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === This paper uses low pressure plasma polymerization technique to deposit fluorocarbon thin film on three substrates including in silicon wafer, polyethylene terephthalate (PET) and carbon paper. The low-pressure plasma was generated with radio frequency power at 13.56 MHz , and monomer selected for the single bond of 1,1,1,2 tetrafluoroethane (C2H2F4). The investigation studied different operational parameters including in deposition time, RF plasma power level, and system pressure. The surface characteristics of the plasma polymerized films have been analyzed by static contact static angle measurement (CA). In addition, the contact angle results based on Owen method, Advancing and receding angles method revealed that surface free energy would decrease after plasma treatment.
The deposited coatings were analyzed by optical thin-film thickness detector, Atomic Force Microscopy (AFM), Fourier Transform Infrared Spectroscopy (FTIR), X-ray Photoelectron Spectroscopy (XPS) and Optical Emission Spectroscopy (OES). The luminous gas phase of plasma state in deposition process was detected by digital camera.
The static contact angle of C2H2F4 plasma polymerized film can reach over 150∘. In addition, surface energy of plasma polymerized film decreased to 5 mJ/m2.. According to AFM analysis, the roughness of plasma polymerized films doesn’t change a lot. XPS and FTIR analysis indicate that the C2H2F4 plasma polymerized film mainly contains CF2 and CF species.
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