The Effects of Flux Residues on Properties of Underfill Materials for Flip Chip Package
碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === The effects of flux residues on the premature failure of underfill epoxy materials used in flip chip packages are investigated by using the solder bump stress analysis, moisture absorption test, differential scanning calorimetry (DSC), thermogravimetric analysi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26088366164850846614 |