A Characterization Study on Adhesion of self-assembled gold-nanoparticle-based nanostructure on Si Substrate

• Main Authors: Jyun-huei Wu, 吳俊輝
• Other Authors: Dau-Chung Wang
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/46599359588844525148

碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 99 === Develop a scheme to identify binding force between deposited Au nanoparticle and the substrate is the goal of the research. Silicon wafer was the substrate used. By soaking in the solution of functional group(MPTMS), wafer surface was modified in order to attract Au nanoparticles. Surface modified wafer was then soaked in Au solution such that Au nanoparticles were attached uniformly to the wafer. The amount of Au nanoparticles on wafer was observed by AFM and FESEM and estimated with the Matlab. By piling up clean wafer on top of the wafer with Au nanoparticles attached, a Si-Au-Si sandwich structure was formed in an oven. In the end, the sandwich structure was tested on Langevin vibrator for fatigue strength identification, by breaking up the sandwich structure. The ratio between fatigue strength and the number of Au nanoparticles on wafer represents the binding force between a deposited Au nanoparticle and the substrate.