Finite Element Analysis for Residual Stress of Oxide Thin Film on Flexible Substrate
碩士 === 國立雲林科技大學 === 光學電子工程研究所 === 99 === The goal of this study was to develop a method depends on Finite Element (FE) for analyzing residual stress of oxide thin film (SiO2 and Nb2O5) deposited on glass (BK7) or flexible substrate (PET and PC) by DC magnetron sputtering deposition. The thermal or i...
Main Authors: | Chen-yu Huang, 黃晨宇 |
---|---|
Other Authors: | His-chao Chen |
Format: | Others |
Language: | zh-TW |
Published: |
2011
|
Online Access: | http://ndltd.ncl.edu.tw/handle/89420769366069968771 |
Similar Items
-
Residual Stresses of Both Titanium Thin Films Deposited on Silicon Wafer and Indium Tin Oxide Thin Films Deposited on Flexible Substrates
by: CHIN-TUN CHUANG, et al.
Published: (2011) -
Residual stress measurement and numerical simulation of ITO thin films deposited on flexible substrates
by: YEH CHEN PEI, et al.
Published: (2009) -
Full Field Analysis of Residual Stress for Transparent Conductive Films on Flexible Substrates
by: Kuo-Ting Huang, et al.
Published: (2015) -
Adhesion of Cu thin films deposited on flexible substrates
by: SU, PO-YU, et al.
Published: (2018) -
Effect of residual stress on thermoelectric transport properties of Bi-Te based thin films on flexible substrates
by: 陳姵如
Published: (2013)