Experiment and simulation of thermal analysis for the high power electronic element at low flowrate with the liquid cooling system of tiny flow channel

• Main Authors: Jyh-Hsuan Lee, 李志軒
• Other Authors: Feng-Chin Tsai
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/76990599842899607916

碩士 === 東南科技大學 === 機電整合研究所 === 99 === This study investigates the flow field design and the thermal solution of the high power heating element by the tiny flow channel cooling system. Heat was impacted directly by water liquid to go through the tiny flow channel of the cooling system and dissipated. The contact area ratio r is 1, 17.54, 38.92 respectively, and the flow rate Q is the0.1~0.5 L/min respectively in the experiments of the heat flux in the range of 2.974 ~ 5.354 W/cm2. By the control parameters are height lift of 28, 38, 48, 58cm respectively and different volume flow, the experiments show the much better cooling effect at contact area ratio r = 38.92 under the condition of the same volume flow and at geometry parameter r = 38.92 under the condition of the same height lift. This result shows the tiny flow channels can promote the cooling effect. This investigation also uses the I-DEAS software to analysis the flow and thermal fields of the tiny flow channel liquid cooling system. The results compared with the practical experimental are not so significant.