Feasibility Analysis of Application of Vapor Compression Cycle System in Electronic Cooling

• Main Authors: Ciao-Jheng Huang, 黃喬正
• Other Authors: 卓清松
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/6yup2m

碩士 === 國立臺北科技大學 === 冷凍空調工程系所 === 99 === This study analyzed the impact on the overall thermal performance in case of different ambient temperatures and the condensation problem. It first established a vapor compression cycle system, and found the optimal refrigerant filling quantity by the refrigerant filling quantity experiment. It then analyzed the impact of spray type evaporator and multi-channel evaporator on system performance in order to further discuss the system condensation caused by vaporization temperature in case of different compressor rotation speeds, condenser cooling fan speeds and ambient temperatures. Finally, it compared relevant theories and experimental results to learn the system performance, and conducted the feasibility analysis. The experimental results suggested that the optimal system refrigerant filling quantity was 100g. When the system used the spray type evaporator, the CPU temperature can be reduced as the highest COP value was about 7.5 when the cooling capacity was 400W. The ambient temperature experiments found that small type vapor compression cycle system was prone to the impact of changes in ambient temperatures. As a result, cooling performance would be affected. It was related to the cooling of system condenser; when the ambient temperature was lower, the thermal exchange would increase to enhance the overall system cooling performance. The condensation experiment suggested that, lower ambient temperatures can effectively reduce dew–point temperature and condensation. Using the spray type condenser can prevent the phenomenon of condenser surface condensation and alleviate the problem of condensation of electronic cooling. In the future, appropriate ambient temperatures can be selected to properly control compressor rotation speed and vaporization temperature according to the heat of electronic components. Thus, it can effectively reduce heat source temperature and improve performance, while making the vapor compression cycle system more energy-efficient and reduce system condensation.