A Study On The Quality In Polyurethane/Graphite Pad Applied For Chemical Mechanical Polishing Oxide Film Of Wafer
碩士 === 國立臺北科技大學 === 材料科學與工程研究所 === 99 === In Chemical mechanical polishing (CMP) field, Polyurethane materials is widely use on polishing pad, because it have porous can save the slurry, but easy cause glazing, because the porous size is not average. In this study, we add two micron (60μm) of graphi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fy5ay6 |