Matching Design,Analysis and Experimental test for High frequency connector coupling with cable and PCB board

• Main Authors: Ho, Shin-Tai, 何鑫泰
• Other Authors: Chiang, Yih-Cherng
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/08937279599907223525

碩士 === 中國文化大學 === 機械工程學系數位機電碩士班 === 99 === In the application of high-frequency Display Port, they are required to weld with coaxial cables by soldering. Usually the connector and coaxial cable can meet regulatory requirements for impedance before soldering welding, but the impedance mismatch occurs in welded part. The impedance characteristics cannot meet the specifications and the product cannot be smoothly produced. Impedance mismatch problem cannot be directly figured out by the measurement results. As measurement all components are needed to be put together, the measured results are the performance of the assembly of the whole. It is unable to find out the cause of impedance mismatch. As testing the high frequency performance of high frequency connector, connector is usually combined with coaxial cables, SMA and PCB test board. The high frequency properties of coaxial and SMA are constant values so that the design of PCB board becomes very vital on high frequency connector measurement. In the past, PCB test boards are sub-contracted to be designed and produced by PCB manufacturer. However, the design of PCB board cannot show the properties but also the performance of the connector. Therefore, we need to design a test version of PCB board by our self to present the best high-frequency performance of connector. The present paper tries to simulate the analysis with CST to solve the impedance mismatch problem in product design and to develop the test PCB board which is compared with experimental data to propose the revision suggestion and optimization design.