The technique of failure location analysis for high integrated circuit module
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 99 === As electronic products go to the powerful, easy to carry, more compact size, low power, and high performance which are the trends of product design. In recent years, the semiconductor manufacturing process was highly improved and rapidly scaling down the gat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3u2847 |