Optimization of Copper Pillar Bump Flip-Chip Package Structure and Materials
碩士 === 國立聯合大學 === 機械工程學系碩士班 === 99 === This work investigated the optimization of copper pillar bump for flip-chip package structure and materials. The test vehicle is 40 nm wafer involved the lead-free copper pillar bump. The finite element method (FEM) was used to analyze the stress of ultra low-k...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92536104413439851107 |