Investigation of the Wire Bonging Technique in the Light-Emitting-Diode Packaging

• Main Authors: Ling Chen, 陳建良
• Other Authors: Yee-wen Yen
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/rh67d9

碩士 === 國立臺灣科技大學 === 醫學工程研究所 === 99 === Among all electrical packaging, wire bonding process is most popular method for electrical interconnection. During the boning process , parameters and bonding material, for example, capillary and chip, played critical roles. In this thesis, we investigated how bonding strength varies with capillary, surface roughness of chip, and wire bond parameters, such as bonding time, bonding force, ultrasonic frequency, by design of experiment method. The design of experiment results indicated that rough capillary is most appropriate for different surface chip, and the optimized bonding parameters are 20 ms, 50 KHz, 40gf, 15um for bonding time, ultrasonic frequency, bonding force and ball thickness respectively. Finally, we performed the long-term burn-in test on these sample and no defect was found which further confirmed the process optimization successful for the bonding process.