Microstructure Evolution of Micron-sized Flip-chip Solder Joints Stressed under High Current Density with Local Temperature Control
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 99 === Progression over time, electronic products developed to be multi-function and ultra-portable. Hence, the ICs’(Integrated Circuits) configuration also according to the roadmap of ITRS(The International Technology Roadmap for Semiconductors), researching instit...
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| Format: | Others |
| Language: | zh-TW |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56466600124542560371 |