| Summary: | 碩士 === 國立清華大學 === 工業工程與工程管理學系碩士在職專班 === 99 === Semiconductor has faced the utmost challenge of cost increase and physical properties at the request of high functions and high density development. In addition to the difficulties of research and development and the milestone increase, the expanse on process development, IC circuit design and equipment capital expend largely. For the reasons above, manufactures and IC maker cannot afford it. To meet the needs of effectiveness and cost control, main semiconductor manufactures make efforts in TSV 3D IC technology. The 3DIC is the main stream technology to increase capacity utilization, decrease power loss, reduce bulk and integrate different kinds of IC. This new technique will bring about the demand to ultra-thin chip. The chip is thinner than 100μm and the difficulties exist. Furthermore, the grain is easily fractured and warped. This condition takes place not only the process of micro section but also after micro section. For the sake of the reasons, 3M Company develops Wafer Support System to carry chips grinded and the procedure of thin film. The purpose of this study is to improve the workstation of glass carrier production process flow. This research takes S Company as an instance. These study combine human ergonomics and work study concept to improve the design of workstation. It focuses on the improvement of glass carrier of Wafer support system process flow through visual inspection, chemical cleaning and final inspection station. Apply the human ergonomics concept and work study point for workstation improvement with the hazard factors against work、human errors and production fail rate. Improving workshop by considering human ergonomics and work study, this study conducts that the drop of defect rate in visual inspection station, chemical cleaning station and final inspection station increases productivity. Moreover, the result indicates that it can reach effective reductions of artificial mistakes and reworking, the return of goods and customers complain. This study also centers on bettering the flaw of production process and reducing the hazard factors against work. Only the continuous improvement as well as providing good quality, low price and early delivery products could stand out from the crowd. Therefore, make case company glass carrier manufacture more competitive via no harmful working environment and increasing working effectiveness. Keywords: Through Silicon Via 3-Dimension、Wafer Support System、Human ergonomics、 Work Study、Hazard factor、Visual inspection
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