Structural Evaluation of Wafer Level Chip Scale Package by Board Level Reliability Tests
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 99 === The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and ability to meet the miniaturization requirements of portable consumer electronics, such as cell phones. For the industry of electronic package, the package life of elect...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50143005187973791755 |