A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology

碩士 === 國立中山大學 === 高階經營碩士班 === 99 === Abstract The 21st century is knowledge-economy era. In the era of knowledge economy, those who dominate the knowledge and the technology are able to meet the challenges in the future. Because of the competition in knowledge and technology, couple with the rise o...

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Main Authors: Min-Ying Chiu, 邱敏瑛
Other Authors: Stephen D. Tsai
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/64805084620050958109
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spelling ndltd-TW-099NSYS54570732015-10-19T04:03:35Z http://ndltd.ncl.edu.tw/handle/64805084620050958109 A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology 半導體封裝測試產業知識管理應用之探討-以頎邦公司為例 Min-Ying Chiu 邱敏瑛 碩士 國立中山大學 高階經營碩士班 99 Abstract The 21st century is knowledge-economy era. In the era of knowledge economy, those who dominate the knowledge and the technology are able to meet the challenges in the future. Because of the competition in knowledge and technology, couple with the rise of information and internet technology, innovation strategy has also taken into the new century. In order to improve organizational performance, management and sharing of corporate knowledge as well as innovation strategies are getting more important, therefore, effective knowledge management and innovation strategy will be one of the key factors of corporate success. Knowledge is the core competitive advantage the most important and the most difficult to imitate. Only through constantly improving, attracting, creating and utilizing abundant knowledge, and integrating in its core competence can it superior to competitors. This thesis adopts case study on one leading domestic company in semiconductor packaging and testing industry. Conduct questionnaire methodology at managers and engineers, and survey five dimensions on knowledge management processes, leadership, corporate culture, information technology and performance evaluation. The main purpose is to realize current implementation of corporate knowledge management, activities and performance, and to conclude the development of knowledge management in the company. Specifically, the purposes of this study are as follows: First, summarize existing literature to understand the effective implementation method for knowledge management. Second, realize corporate current status of knowledge management activities. Third, research on how the company strengthens existing knowledge management practices to retain the core knowledge, enhance manpower quality, and create added value after merging into a fast-growing organization. Finally, the suggestion on KM implementation is proposed for reference. By way of questionnaire survey and in-depth interviews to understand current application and direction of knowledge management, and to conclude specific suggestions for improvement reference, hopefully this thesis benefits the company to enhance corporate competitiveness. Stephen D. Tsai Chang-yung Liu 蔡敦浩 劉常勇 2011 學位論文 ; thesis 83 zh-TW
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description 碩士 === 國立中山大學 === 高階經營碩士班 === 99 === Abstract The 21st century is knowledge-economy era. In the era of knowledge economy, those who dominate the knowledge and the technology are able to meet the challenges in the future. Because of the competition in knowledge and technology, couple with the rise of information and internet technology, innovation strategy has also taken into the new century. In order to improve organizational performance, management and sharing of corporate knowledge as well as innovation strategies are getting more important, therefore, effective knowledge management and innovation strategy will be one of the key factors of corporate success. Knowledge is the core competitive advantage the most important and the most difficult to imitate. Only through constantly improving, attracting, creating and utilizing abundant knowledge, and integrating in its core competence can it superior to competitors. This thesis adopts case study on one leading domestic company in semiconductor packaging and testing industry. Conduct questionnaire methodology at managers and engineers, and survey five dimensions on knowledge management processes, leadership, corporate culture, information technology and performance evaluation. The main purpose is to realize current implementation of corporate knowledge management, activities and performance, and to conclude the development of knowledge management in the company. Specifically, the purposes of this study are as follows: First, summarize existing literature to understand the effective implementation method for knowledge management. Second, realize corporate current status of knowledge management activities. Third, research on how the company strengthens existing knowledge management practices to retain the core knowledge, enhance manpower quality, and create added value after merging into a fast-growing organization. Finally, the suggestion on KM implementation is proposed for reference. By way of questionnaire survey and in-depth interviews to understand current application and direction of knowledge management, and to conclude specific suggestions for improvement reference, hopefully this thesis benefits the company to enhance corporate competitiveness.
author2 Stephen D. Tsai
author_facet Stephen D. Tsai
Min-Ying Chiu
邱敏瑛
author Min-Ying Chiu
邱敏瑛
spellingShingle Min-Ying Chiu
邱敏瑛
A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
author_sort Min-Ying Chiu
title A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
title_short A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
title_full A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
title_fullStr A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
title_full_unstemmed A study of knowledge management applications in semiconductor packaging and testing industry-case of Chipbond Technology
title_sort study of knowledge management applications in semiconductor packaging and testing industry-case of chipbond technology
publishDate 2011
url http://ndltd.ncl.edu.tw/handle/64805084620050958109
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