Deposition of vertically aligned carbon nanotube for interconnect application
碩士 === 國立中央大學 === 機械工程研究所 === 99 === This research is using low temperature chemical vapor deposition (LTCVD) to grow carbon nanotubes (CNTs) for interconnect application. We use integrated-circuit (IC) photolithography to manufacture the structure of interconnect via in silicon wafer, than developm...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36844767885347614828 |