Application parallel optical Interconnection technology for 40Gb/s optical sub assembly

碩士 === 國立中央大學 === 機械工程研究所碩士在職專班 === 99 === With continuously innovation and progress technology, the requirements of image and data transfer increase significantly. The transmission bandwidth which uses traditional wire and cable as a medium has been insufficient. The transmission speed and mode wil...

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Bibliographic Details
Main Authors: Tzu-Ching Yeh, 葉子敬
Other Authors: none
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/84080804872500326046
Description
Summary:碩士 === 國立中央大學 === 機械工程研究所碩士在職專班 === 99 === With continuously innovation and progress technology, the requirements of image and data transfer increase significantly. The transmission bandwidth which uses traditional wire and cable as a medium has been insufficient. The transmission speed and mode will turn towards a new situation. Optical fiber will eventually replace traditional ways and become the a whole new communication methods. In this paper, we refer to much passive optical interconnection alignment technology in parallel light. To consider all the benefits and disadvantages, we develop a technique on the 40Gb/s parallel optical sub-assembly which have a simple structure, less cost and easily manufactured.These techniques have also applied on the 40Gb/s QSFP (Quad Small Form-factor Pluggable) transceiver module. The technique basically use a LTCC (Low-Temperature Cofired Ceramics) to be the substrate and place a 4x10Gb/s VCSEL and PD array devices on it. One 45° reflection inclined plane and 12 micro-lens are mounted on the devices to guided the light into the multi-mode fiber with passive optical interconnection alignment. After many experiments and improvements, the optical power of the VCSEL are increased from -18.62 to -0.42 dBm and the C.E.(Coupling Efficiency) are also improved from 15.26% to 45.05%. The sensitivity of the PD can be measured in -11 to -12 dBm.