Simulation and Analysis of Thermoelectric Measurement Methods Under Atmospheric Pressure

• Main Authors: Chuan-Jyun Wang, 王傳鈞
• Other Authors: Ming-Tsung Hung
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/87617654698054132455

碩士 === 國立中央大學 === 能源工程研究所 === 99 === This paper is to introduce the thermoelectric simulation analysis and design measured at atmospheric pressure.When the simulation and measurement at atmospheric pressure, the environmental factor needs to be considered.Therefore, designing a closed system in order to let the temperature become stable and reduce the error during the process of measurement.At first, we need to understand the way of controlling thermoelectric materials, and simulate the thermoelectric materials by finite element. From the process of simulation, we would observe the change of thermoelectric materials. This experience is based on : 1.thermoelectric simulation 2. closure of the flow patterns within the system. we use Navier-Stokes and Thermal diffusion equation to simulate and analyze. We discuss the effect of natural convection especially. However, the current thermoelectric materials have been extensively studied and used, but did not seem to be the measurement standard, therefore, with the simulations to investigate the thermal changes in the process of verification through simulation, then by the way Set up thermal power measurement equipment, so the device can be Seebeck coefficient and thermal conductivity measurements. Finally, the structure for two different materials to measure, respectively, to explore the structure of silicon and porous silicon materials, to compare the differences between the measured values, and by measuring the results to understand the same material, but different Structure, will have different thermoelectric effect, which is due to changes in thermal conductivity, which affects the figure of merit (ZT) changes. This simulation is the use of Comsol finite element analysis software thermal model to investigate the temperature distribution and thermal coupling effect.