Electromigration Failure Time and Micro-structure Study in Flip-Chip SnPb Solder Joints by Different Pre-aging Times
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === Flip-chip technology has become a mainstream trend in advanced electronic packaging because of its capability of higher I/O density and smaller package size. With higher current and smaller size trends, electromigration in flip-chip solder has be...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/37265075355241590503 |