| Summary: | 碩士 === 國立交通大學 === 理學院應用科技學程 === 99 === On-line re-probing function of failed dies is used to increase the 1st yield in order to reduce the probability of wafer re-loading for off-line re-testing. It will perform re-testing before wafers are unloaded from the prober when the result of the 1st yield is low. This is for the purpose of saving the setup time in off-line re-testing. Most of the product engineers are interested in reducing off-line re-testing and increasing the wafer yield by using the on-line re-probing function of failed dies. However, it wastes testing productivity if the re-testing cost is higher than re-testing benefit.
In this study, we collected wafer testing and cost related data from one of Taiwan’s testing facilities in 2010. We analyzed the factors of wafer recovery yield and established the regression model to predict the recovery yield for the on-line re-probing function of failed dies. As a result, the yield prediction model is used to evaluate the re-testing cost and benefit. It’s recommended to perform on-line re-probing of failed dies if the re-testing benefit is greater than the cost. The recovery yield prediction model will help testing facilities to establish a cost-effective re-testing mechanism in order to reduce cost and increase productivity of testing equipments. This is the main contribution of this study.
According to the test results of empirical studies, the prediction model can be applied to increase net profit. Thus, it is valuable for the testing industry to enhance production efficiency and improve the company’s competitiveness.
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