| Summary: | 碩士 === 國立交通大學 === 電子研究所 === 99 === The thesis investigates the electromigration behavior of Cu-Ni nanocomposite with an optimal composition for low- power electromagnetic microactuator fabrication. Blech stripes covered with a 1μm-thick PECVD oxide were designed and utilized for the behavior characterization. The drift velocity, critical length, critical product, and activation energy of the Cu-Ni nanocomposite, which are 565nm/hr, 14μm, 1714 A/cm, and 0.39eV respectively, have been measured at 275 ?aC and with a stress current density of 1.19×106 A/cm2. The activation energy of the Cu-Ni nanocomposite is about 0.39eV in the temperature range of 275-305 ?aC. In comparison with the values of Cu which are 88nm/hr, 20μm, 2365 A/cm, and 1.09eV, respectively, the poor electromigration behavior of the nanocomposite can be attributed to an as-plated rough surface morphology which will result in void formation in the interface between itself and the passivation oxide. The voids would ease the surface diffusion of Cu atoms in the composite and aggravate the electromigration phenomenon.
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